- Most significant machine model for 300mm wafers
High precision, high rigidity, high throughput machine. - Better cost performance for 300mm wafers.
- 300mm Framed wafer & CSP handling machine.
- It is the prober with high-speed probing that targets non-memory device.
- Most significant machine model for 200mm wafers
High precision, high rigidity machine. - Highly efficient, High throughput, wafer & CSP handling machine.
Better cost performance machine. - High-speed machine for discrete.
- 200mm Framed wafer & CSP handling machine
- Accretech Probing Machine for full wafer testing on a single touch down. Developed with capability to simultaneously measure on 12 stages with dedicate XY stage and POGO tower.
- Consolidated management of the operation of probing machines for higher operation rate.
- This network allows you to consolidate the management of resources with the user host.
- The GEM Network System supports standards based on the SEMI standards to achieve factory automation at customers.
- This is a group of dedicated terminals for increasing the efficiency of test areas.
Tsk Uf200
Precio™ XL
Information on Probing machine: UF2000 can be found. Most significant machine model for 200mm wafers High precision, high rigidity machine. Tsk Uf200 Prober Manual Vimeo and Photobucket Mislabeling Some of the items in this app were'Tsk Prober Manual Free Ebooks 27 98 230 35 bc April 23rd, 2018 - Tsk prober manual descriptions Tsk prober manual Books is good. TSK UF200 Prober. SESO S T S 894-B Faulstich Ct. San Jose CA 95112 408-956-9268 TSK PROBER UF200 Manufacturer: TSK Model: UF 2000. Manual wafer inspection transfer tool (1) Dual robotic wafer transport arms (1) Pre-alignment stage unit (1) Capacitive non-contact displacement sensor, P/N: 293311.
Uf200 Prober Manuals
Precio™ XL is the latest 300mm fully automated wafer prober developed based on TEL Precio™ series. The Precio™ XL realizes high productivity, contact performance, cleanliness improvement, and short delivery time with a concept to further reduce test costs. TEL has also provided high-speed probe mark inspection TELPADS™-I and Auto Leveling (the probe card parallelism Automatic adjustment function), Users have available to them ZOOM-I which supports various Z-axis control for stable contact and soft contact, as option. The Precio™ XL wafer prober is compatible with the wafer parameters of previous Precio™ models. In addition, focusing not only on test operations but also on efficiency of setup file generation, we have introduced CoSMOz (Contact Sequence Map Optimization) software option. CoSMOz has the capability to calculate the optimum contact sequence, which was previously performed by customer test engineers. We have realized significant improvement in work efficiency and improvement in test efficiency.